中国高校科技期刊研究会第9次会员代表大会在北京召开，中宣部出版局副局长张怀海、教育部科学技术与信息化司一级巡视员张国辉等领导出席会议并发表..
英文简介：Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:? Advanced packaging? Ceramics? Chip attachment? Chip on board (COB)? Chip scale packaging? Flexible substrates? MEMS? Micro-circuit technology? Microelectronic materials? Multichip modules (MCMs)? Organic/polymer electronics? Printed electronics? Semiconductor technology? Solid state sensors? Thermal management? Thick/thin film technology? Wafer scale processing.中文简介：（来自Google、百度翻译）微电子国际提供了一个权威，国际和独立的论坛，用于评估和传播与高级封装，微电路工程，互连，半导体技术和系统工程有关的研发，应用，过程和当前实践。它代表了一种最新、全面和实用的信息工具。编辑John Atkinson博士欢迎对该期刊的贡献，包括技术论文，研究论文，案例研究和评论论文以供发表。有关更多详细信息，请查看作者指南。Microelectronics International对与微型电子设备和高级封装的设计，制造，组装和各种应用相关的关键技术和相关问题进行了多学科研究。涵盖的广泛主题包括:? 高级封装 ? 陶瓷 ? 芯片附件 ? 板上芯片 (COB)? 芯片级封装 ? 柔性基板 ? MEMS? 微电路技术 ? 微电子材料 ? 多芯片模块 (MCMs)? 有机/聚合物电子 ? 印刷电子 ? 半导体技术 ? 固态传感器 ? 热管理 ? 厚/薄膜技术 ? 晶圆级处理。
